David P. Field

Present Position
Assistant Professor, School of Mechanical and Materials Engineering

Education
PhD, Yale University, 1991

Research Interests:
Metal deformation and recrystallization,
crystallographic texture,
grain boundary structure,
thin film and IC interconnect structure/properties relationships,
and advanced experimental techniques

Recent Publications:
Kononenko, O.V., Matveev, V.N., and Field, D.P. "Electromigration Properties of Multigrain Aluminum Thin Film Conductors as Influenced by Grain Boundary Structure", Journal of Materials Research, submitted Feb. 2000.

Flinn, J.E., Field, D.P., Korth, G.E., Lilo, T.M., and Macheret, J. "The Flow Stress Behavior of OFHC Polycrystalline Copper," Accepted, Acta Mater. Sept. 2000.

O. V. Kononenko, V. N. Matveev, and D. P. Field, "The Energy of Activation of Electromigration in Aluminum Conductors Tested by the Drift-Velocity Method", Russian Microelectronics, 29, p. 316 (2000).

Kononenko, O.V., Matveev, V.N., and Field, D.P. "Electromigration Activation Energy in Aluminum Conductors Tested by the Drift Velocity Method", Scripta mater. 42, 621-626 (2000).

Field, D.P. and Dingley, D.J. "Orientation Imaging of Heavily Deformed Metals", Revista Latinoamericana de Metalurgia y Materiales, 19, 37-42 (1999).
Field, D.P., "QC for IC Interconnects?" Vacuum and Thin Films, pp. 36-40, Jan. 1999.

Wright, S.I. and Field, D.P., "Recent Studies of Local Texture and Its Influence on Failure" Mat. Sci. Eng. A257, 165-170, 1998.

Keller, R.R., Nucci, J.A., and Field, D.P., "Local Texture and Grain Boundary Structure Characterization in Voided Copper Interconnects", J. Elect. Materials, 26, 996-1001 (1997).